solar control film print circuited board magnetron sputtering metallizer plant

Film Vacuum Metalizing Machine Vacuum Metallizer (Magnetron Sputtering Type)

Substrate: PET OPP CPP

Application: solar control film or window film for vehicle, automobile etc, higher technology product accessory such as printed circuit board, LED displaying screen, solar energy battery plate etc.

Introduction:
Advantage: the most matured technology of magnetron sputtering industry in China
1. This series machine is our company newest development with the top technology in China, widely used in all kind of higher technology fields, especially for Titanium and copper metalizing.
2. Theory: Magnetron sputtering is a highly versatile technology for thin film deposition. Running at typical pressures in the 3.5x10-3 mbar range and using Ar gas, it employs a glow discharge or plasma generated by a purpose-made high negative-voltage power supply to generate gas ions which bombard the surface of a ‘target’ of the coating material. Material is then 'sputtered' from the target due to the impact of the Ar ions.
Ar is used as the process gas because it is inert and relatively inexpensive, but gases such as O2 and N2 can be introduced to deliberately react with the sputtered material to deposit oxides and nitrides for example. Additional techniques include pulsed DC sputtering for specific applications.
A full range of circular and linear magnetron sputter sources which are engineered to meet specific and stringent R&D and production requirements. It uses well proven designs providing ease of use, with excellent target utilization, deposited film uniformity and reliability.
3. High quality core parts: 1), Siemens touch screen and PLC control, 2), best quality brand pump 3), Imported SKF bearing 4), High quality Polycold system, 5), Plasma treatment.

Features:
1. Minimum waste for raw material (within 10%) and maximum working efficient ensuring most amount profit for user.
2. Plasma treatment for ensuring metalizing performance.
3. Domestic best sputtering target material.
4. The best fastness of metallizing layer contrast to all other kind metallizers.