Underfilled Adhesive 5219

Before using must remained to room temperature ( 30ml

packages need to warming more than 2H; 250ml packages need to warming more than 4H ).

Can be directly filled under room temputure, In need of accelerating the filling speed

of PCB board, preheat the PCB and the temperature should be below 90 DEG c..

Recommend dispensing pressure 0.10-0.3Mpa, dispensing velocity of 2.5-12.5mm / s. For

a large area of the chips,glue injection can be divided to two or three times .

Have a repairance when the mechanical defects , simply by heating the chip until the

temperature reaches the solder melting,carefully twist element, destroyed the

adhesive layer, take element with vacuum suction or tweezers and clean with brush and isopropanol cleaning, not excessive force.