Thermelt 892

Thermelt 865 is a high quality, non-reactive, solvent-free, pure copolymer polyamide hot melt resin, specially designed for Low Pressure Moulding applications.

It offers solutions for encapsulation of electronic parts in the automotive industry for external uses such as door locks and aerials.

Thermelt 865 was developed specifically for improving adhesion on a wide range of substrates and offers cohesiveness at negative temperatures (-40¬C)

Good adhesion on PVC and ABS plastics
Good brittleness resistance at negative temperatures: encapsulant remains flexible and does not break when exposed to cold
Complies with flammability standard UL94 V0: excellent flame-retardant properties


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We are research and development high performance engineering thermoplastics compounds solutions for custom made to suit your demanding industrial environments requirements. Applicative in harsh industrial environments, used in particular in aerospace, Medical, Automotive, Railway, Machinery, Fiber optic cable jackets, Connector housings, Assembly components/safety products,kitchen utensils(food & water contact) and 3D printing.

We truly appreciate your understanding and look forward to cooperate with you.