TUF 1613 HT-CM

Kohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120®C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures. TUF 1613 HT-CM offers an extensive serviceable temperature range of -70®C to +200®C. This product can withstand severe thermal cycling and shocks. Being a one component system. it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides outstanding bonding and physical strength properties, as well as dimensional stability. TUF 1613 HT-CM is a 100% solids system i.e. it does not contain any solvents or diluents. In addition to superior electrical insulation, TUF 1613 HT-CM also offers very good thermal conductivity. It has a black color. It also extends phenomenal chemical resistance to a variety of acids, bases, fuels and water. TUF 1613 HT-CM although most commonly used for glop topping, its superior performance and the ability to pass NASA low outgassing standards, makes it suitable for use in various electronics, aerospace and vacuum applications.

PRODUCT HIGHLIGHTS
Thermal conductivity; efficient heat transfer
Superior electrical insulation
Rapid cures
Outstanding dimensional stability
Capable of passing NASA low outgassing
Unlimited working life at room temperature

TYPICAL APPLICATIONS
Bonding & Sealing
Coating
Potting
Glob Top
Die Attach