Resin bond diamond cup wheel for silicon wafer Photovaltaic industry abrasive tools

Resin bond diamond cup wheel for silicon wafer Photovaltaic industry abrasive tools
Silicon wafer grinding wheel size chart
Diameter Thickness Hole Rim Width Rim Thickness
200 35 76 3,5,6,9 3~8
200 50 80 3,5,6,9 3~8
200 60 80 3,5,6,9 3~8
220 65 180 3,5,6,9 3~8
300~350 20~40 127 5,7 3~8

Usage: Diamond Abrasive Tools are used for hard carbide, optical glass, gem, semi-conductor materials, non-ferrous materials, and non-metallic material grinding, cutting or electrolytic grinding.
CBN Abrasive Tools are used for grinding ferrous metal, such as refractory alloy, vanadium steel, cobalt steel, molybdenum steel, high speed steel, bearing steel and titanium steel etc. Customized super abrasives are also available for various procedures.
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