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Qianli IP-01 02 BGA Ball Mounting Platform
Price: | US$ 19.99 / Piece |
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Minimum Order: | 1 |
Payment Terms: | L/C D/P T/T D/A paypal |
Port of Export: | Shenzhen |
Product Details
Model No.: | FX533N | Brand Name: | Qianli |
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Certification: | |
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Specification: | 15*15*15CM |
Packaging & Delivery
Packaging: | carton |
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Delivery/Lead Time: | 3days |
Production Capacity: | 100000000 |
Product Description
QianLi ToolPlus iP-01 iP-02 Middle layer frame BGA reballing stencil platform for iPhone X XS XS MAX 1 Pro MAX motherboard repair, ToolPlus iP-01 iP-02 iPhone middle layer planting tin soldering fixture, Qianli 3D BGA reballing metal stencil motherboard middle frame planting tin reballing platform for iPhone logic board repair net fixture
Features :
Durable, unique design
Seiko, featured material
Precise positioning
Efficiency Improvement
Strong magnetic attraction
Stencils won't deform under high temperature
High quality Phone Middle Frame Reballing Platform
BGA Reballing Platform for Phone X/XS/XS MAX/11/11 Pro/11 Pro MAX.
Make your repair work easier
QianLi ToolPlus iP-01 iP-02 BGA Reballing Platform for iPhone X-11 Pro Max Logic Board Dissembling and Assembling Testing Tool
SUPPLIER PROFILE
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Company: | Shenzhen weixiu technology Co.,Ltd | ||
City/State | shenzhen, 粤 | Country: |
China ![]() |
Business Type: | Other Trade Services | Established: | NA |
Member Since: | 2023 | Contact Person | phonefix nicole |
SUPPLIER PROFILE
City/State/Country -
shenzhen, 粤
China 

Business Type -
Other Trade Services
Established -
NA
Member Since -
2023
Contact Person -
phonefix nicole