PCBA Manufacturing/Electronics PCB Assembly Supplier

PCB Capability Parameter:
Item Mass processing capability Sample&Prototype Processing capability
Layer(MAX) 2-18 20-30
Type of the board material FR-4,high TG Board,aluminum
board rogers, etc.,F4,BT FR4,high TG Board,aluminum
board Rogers,etc.,F4,BT
Compound pressed board 4layers--6layers 6layers--8layers
Maximum Size 610mm*1100mm
Outline size tolerance +/- 0.13mm +/- 0.10mm
Board Thickness range 0.3mm-6.00mm 0.20mm--8.00mm
Board Thickness tolerance +/- 8% +/- 5%
Board Thickness Range +/- 10% +/- 8%
Medium Thickness 0.076mm-6.00mm 0.076mm--0.100mm
Minimum line width 0.075mm 0.063mm
Minimum space Distance 0.075mm 0.063mm
Outer layer copper thickness 8.75um--175um 8.75um--280um
Inner Layer copper thickness 8.75um--175um 8.75um--220um
Drill hole size(power drill) 0.25mm--6mm 0.15mm--0.25mm
Hole size(power drill) 0.20mm--6mm 0.05mm--0.20mm
Hole size tolerance(power drill) 0.05mm
Hole position deviation
(power drill) 0.075mm 0.05mm
Laser hole size 0.10mm 0.075mm
Aspect Ratio 10:1 12:1
Solder mask type Sensitive green,yellow.
Black,purple,blue,ink Sensitive green,yellow.
Black,purple,blue,ink
Mininum width of solder
mask bridge 0.10mm 0.075mm
Minimum size of solder mask
Separation ring 0.05mm 0.025mm