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MIJING Z20 Pro middle layer reballing platform
| Price: | US$ 26.99 / Piece |
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| Minimum Order: | 1 |
| Payment Terms: | L/C D/P T/T D/A paypal |
| Port of Export: | Shenzhen |
Product Details
| Model No.: | Z20PRO | Brand Name: | MIJING |
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| Certification: | |
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| Specification: | 15*15*15cm |
Packaging & Delivery
| Packaging: | carton |
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| Delivery/Lead Time: | 3days |
| Production Capacity: | 100000000 |
Product Description
MJ Z20 Pro Phone motherboard middle layer frame tin planting platform with stencil steel mesh for Phone X-14 Pro Max motherboard soldering repair. Product Features:
Phone X-14 PRO MAX BGA reballing fixture tool.
Used for positioning and reballing Phone X-14 Pro Max PCB BGA parts.
Convenient and faster for reballing BGA without any damage.
Offer you best solution for Phone X-14 Pro Max BGA reballing and repairing.
How to install:
Install the Phone X-14 Pro Max main board on the platform
Cover the Phone X-14 Pro Max BGA reballing stencil on mainboard
Evenly spread tin on the cover of the reballing stencil
Remove the reballing stencil cover
Take out the motherboard and cooperate with the hot air gun to solidify the tin point.
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SUPPLIER PROFILE
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| Company: | Shenzhen weixiu technology Co.,Ltd | ||
| City/State | shenzhen, 粤 | Country: |
China 
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| Business Type: | Other Trade Services | Established: | NA |
| Member Since: | 2023 | Contact Person | phonefix nicole |
SUPPLIER PROFILE
City/State/Country -
shenzhen, 粤
China
Business Type -
Other Trade Services
Established -
NA
Member Since -
2023
Contact Person -
phonefix nicole