Low temperature conductive silver plasm

Product description

This product is use high technology means to make patch copper cover silver particle into plasm, it use copper replace silver, so the price is much better, but the result is same.

Product feature

Good conductivity, stability chemical characters, low cost and it is not easy oxidation

Color: silver yellow

Particle diameter: 5¥Ìm
Content: 43ÿ?%
Density: 1.1ÿ?.5g/m3
Adhision degree: 8-16s(25ÿ?
Resistance¡ºÿ?.1¥¸/ÿ?
Spraying area: 4-10m2

Application range

Plus it into rubber, plastic and fabric to form different conductive products
All kinds of conductive and guiding static micro-electronics fields
Electromagnetism screen, non conductive materials surface
Electronics, machine, communication, printing aviation , spaceflight and weapon

Notice

Before use it , mixing it equality
Preservation period: 6 months
Drying temperature 135ÿ?
Keeping away from heat sources, fire and high temperature