LEAD FREE HASL PCB / IMMERSION TIN PCB

LEAD FREE HASL PCB / immersion tin pcb
Lead-free HASL is to coat a layer of tin-lead alloy on the copper surface to prevent the oxidation of the copper surface and provide a good welding base for the subsequent assembly process. What is hot air leveling? It is actually a process of combining dip soldering and hot air leveling, and coating eutectic solder in the metalized holes of lead-free printed circuit boards and printed wires. The process is to first dip the lead-free printed circuit board with flux, then dip the molten solder, and finally pass between the two air knives. Use the hot compressed air in the air knife to remove the excess on the printed board The solder is blown off, and at the same time, the excess solder in the metal holes is eliminated, thereby obtaining a bright, smooth, and uniform solder coating.

Features of lead free hasl pcb
The immersion tin process can form a flat copper-tin intermetallic compound. This feature makes the immersion tin have the same good solderability as hot air leveling without the troublesome flatness problems of hot air leveling; nor does it have electroless nickel plating / Diffusion issues between gold and metal; just the tin immersion board cannot be stored for too long.

Immersion tin does not bring any new elements into the solder joint, which is especially suitable for communication backplanes. The use of the immersion tin board is restricted due to the inconvenience of storage and the carcinogens contained in the process. About 5% -10% of PCBs currently use a dip tin process.

Parameters of Lead Free HASL PCB
1. Prevent oxidation of bare copper surface; 2. Maintain solderability
SPEEDAPCB has a mature HASL production line, as well as particularly experienced engineers, we will do our best to provide you with the perfect plate making service.

Board name USB transfer board
Layers of number 4
Thickness of board 1.6mm
Surface treatment HASL
Min Line width /line spacing 6/6mil

Board name Power signal acquisition board
Layers of number 6
Thickness of board 1.6mm
Surface treatment HASL
Min Line width /line spacing 5/5mil

Board name High power board
Layers of number 2
Thickness of board 2.0mm
Surface treatment HASL
Min Line width /line spacing 15/15mil

Board name Data storage board
Layers of number 6
Thickness of board 1.6mm
Surface treatment HASL
Min Line width /line spacing 4/4 mil

Board name Signal sampling backplane
Layers of number 6
Thickness of board 2.0mm
Surface treatment HASL
Min Line width /line spacing 4/4 mil

Board name 2.4G Microwave antenna sink silver board
Layers of number 6
Thickness of board 1.6mm
Surface treatment HASL
Min Line width /line spacing 5/5 mil


Board name HD image processor board
Layers of number 12
Thickness of board 1.6mm
Surface treatment Gold finger + Tin Spray + Hot Air Leveling


4/4 5/5 mil

Characteristics of Lead Free HASL PCB
The most prominent advantage of solder coating with hot air leveling is that the coating composition always remains the same, and the edges of the printed circuit can be completely protected.

The cost of hot air leveling is lower than other surface treatments, the process is mature, and the weldability is good.

As a pcb design ltd, SPEEDA Technology, founded in 2014 and located in Changsha City, Hunan Province, supports our customers with PCB service and design. We are committed to providing our customers with high-quality, high-layer board manufacturing services.