Advertisements
KB 1458 TC
| Price: | Contact for latest price |
|---|---|
| Minimum Order: | |
| Payment Terms: | TT |
| Port of Export: |
Product Details
| Model No.: | Brand Name: |
|---|
| Certification: | RoHS Compliant and NASA (Low Outgassing ASTM E-595) |
|---|---|
| Specification: | Two-part epoxies are special polymer systems where the resin and the curing agent are stored in separate containers. The two components (commonly referred to as Part A and Part B) are required to be mixed in the specified mixing ratio. After mixing, the polymerization occurs readily at ambient temperatures or at elevated temperatures for faster cures. Kohesi Bond offers a wide range of two component epoxies with varying working lives and curing properties. The most significant advantage of these products is their ability to cure at room temperature, thus offering an array of performance properties for applications where adding heat for curing is not feasible. Our products can be customised and packaged to meet your specific requirements. Specialty packaging is also available for automated metering and mixing of the two parts, offering ease of use and higher yields. |
Packaging & Delivery
| Packaging: | Cans, Pails |
|---|---|
| Delivery/Lead Time: | |
| Production Capacity: |
Product Description
Kohesi Bond KB 1458 TC is a one-of-a-kind, two component, thermal management epoxy system. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin as 10 microns. The efficiency of heat transfer improves exceedingly with lower thermal resistance. This can be explained easily with the following formula:
R = l/K [“R” is the thermal resistance; “l” is the adhesive layer thickness; “K” is the thermal conductivity of the adhesive]
Applying peculiar values, standard thermally conductive adhesives (alumina filled) that are applicable in more than 50 micron thicknesses, offer a thermal resistance of 35 – 40 × 10-6 m2·K/W. Since KB 1458 TC can be applied in 10 micron thick sections, it offers a notably low thermal resistance of 5 – 6 × 10-6 m2·K/W.
KB 1458 TC has a wide serviceable temperature range of -70®C to +150®C. It adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides superior bonding and physical strength properties and very low shrinkage upon cure. In addition, it offers excellent dimensional stability and a very low coefficient of thermal expansion (CTE). Part A and Part B are gray in color. Owing to its sensational thermal management properties KB 1458 TC is widely used in electronics, optical and specialty OEM industries.
PRODUCT HIGHLIGHTS
Unrivaled heat transfer efficiency
Low coefficient of thermal expansion (CTE)
Superb mechanical strength properties
Microns thin bond lines achievable
Phenomenal electrical insulation properties
Unlimited working life at room temperature
TYPICAL APPLICATIONS
Bonding
Sealing
|
SUPPLIER PROFILE
|
|||
|---|---|---|---|
| Company: | Kohesi Bond | ||
| City/State | Mumbai, Maharashtra | Country: |
India 
|
| Business Type: | Export - Manufacturer / Trading Company | Established: | 2015 |
| Member Since: | 2017 | Contact Person | Utsav Shah |
SUPPLIER PROFILE
City/State/Country -
Mumbai, Maharashtra
India
Business Type -
Export - Manufacturer / Trading Company
Established -
2015
Member Since -
2017
Contact Person -
Utsav Shah