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IC Design Application PCB
| Price: | Contact for latest price |
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| Minimum Order: | |
| Payment Terms: | Need to disscuss |
| Port of Export: | Taiwan Taoyuan International Airport |
Product Details
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| Specification: |
Technologies
●Any layer HDI ●Aspect ratio up to 25 ●Back drill ●Board thickness 10 mm / 390 mil ●Cavity down ●High speed and low loss materials ●Layer count up to 40 ●Micro via copper-fill plate ●Minimum line width / spacing 2 mil (50 micro meters) ●Thermal management-coin inserted ●VIP (via in pad): conductive-conductive copper paste ; non-conductive-epoxy via hole fill |
Packaging & Delivery
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Product Description
Applications
Smart Phones, Internet of Things, Multimedia A/V, Telecommunication Equipment, Sensing Component, Smart TV, DVD/Blu-ray Storage System, Smart Audio System, Home Networking Device System, Smart CPU&GPU, Broadband Gateway and Set-top Box, Tablet, LTE Modem Platform, RF Transceiver, NFC( Near Field Communication) Product, Bluetooth Product, GPS (Global Positioning System) Product, Wireless Charging and Wearable Device.
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SUPPLIER PROFILE
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| Company: | Shin Puu Technology Co., Ltd. | ||
| City/State | Luzhu Dist, Taoyuan | Country: |
Taiwan - Province of China 
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| Business Type: | Export - Manufacturer / Trading Company | Established: | 2001 |
| Member Since: | 2018 | Contact Person | Christina Pai |
SUPPLIER PROFILE
City/State/Country -
Luzhu Dist, Taoyuan
Taiwan - Province of China
Business Type -
Export - Manufacturer / Trading Company
Established -
2001
Member Since -
2018
Contact Person -
Christina Pai