High thermally conductive material: aluminium nitride

High thermally conductive material: aluminium nitride - used as additives of plastics or in semiconductor devices encapsulated.
aluminium nitride nano powder, produced by Plasma Arc Vapor Synthesis technology & reactor patented by our company- Hefei Kaier Nano-meter Technology and Development Limited Company, possesses small APS, large specific surface area, high surface activity, good injection formation property, high modulus, high dielectric, refractory, good shock and heat-resistance, lower thermal expansion, good compatible with silicon, excellent thermal conductivity. It provides lower sintering temperature and higher strength and ductility from the compaction. It offers excellent resistance to wafer processing gases and plasma erosion.
Thermally conductive aluminium nitride- filled epoxy resin used for electronic packaging, semiconductor devices encapsulated: thermal conductivity and relative permittivity of the AlN particulate-filled epoxy resin are high, and the coefficients of thermal expansion is low. The temperature dependence of the thermal conductivity is deduced from the temperature of the thermal conductivity.
Aluminium nitride used as additives of plastics such as PET, PP, PVI etc., could increases the thermal conductivity and their melting point, featuring high or low temperature resistance and high intensity. We have the dispersion technology and could solve the problems for customers.