DOCBOND|Underfill

DB840B

The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by mismatching of overall temperature expansion characteristics between the silicon chip and the substrate or external forces. Fast curing when heated. The lower viscosity characteristics allows for better underfilling; and good reworkability.

Applications：
Mobile phones, smart terminals on-board vehicles
Other handheld devices, etc. Filling of CSP/BGA

Huizhou DOCBOND New Material CO.LTD is a national high-tech enterprise specializing in the research and development, production, and market promotion of new materials such as fuel cell adhesive and composite bipolar plate substrate in the field of hydrogen energy.
DOCBOND was incorporated in November 2014 and settled in the accelerator of fine chemical technology enterprise in the petrochemical zone of Daya bay economic and technological development zone in Huizhou， and received two rounds of investment funds from the local government
DOCBOND's primary research and development products have two major sections: high-end electronic adhesives and adhesives for hydrogen energy fields.