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DOCBOND|Low Temperature Curing Adhesive
| Price: | US$ xx |
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| Minimum Order: | |
| Payment Terms: | PayPal |
| Port of Export: | Huizhou |
Product Details
| Model No.: | DB291 | Brand Name: | DB291 |
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| Certification: | |
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| Specification: |
Color：Black
Viscosity 15000cps～20000cps Cure Condition 30Min@80℃ Glass Transition Temperature 65℃ Hardness ≥70D Shear Strength 15Mpa Storage Condition 6months@-20℃ |
Packaging & Delivery
| Packaging: | 30ml/50ml |
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| Delivery/Lead Time: | |
| Production Capacity: |
Product Description
Product：DB291
This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a very short time. The product has excellent working performance and high storage stability. This product is suitable for low-temperature curing process, mainly used for bonding heat-sensitive components,suitable for memory cards, CCD/CMOS, LED backlights etc.
Applications
Bonding for camera module,LED backlight and low temperature process component
Huizhou DOCBOND New Material CO.LTD is a national high-tech enterprise specializing in the research and development, production, and market promotion of new materials such as fuel cell adhesive and composite bipolar plate substrate in the field of hydrogen energy.
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SUPPLIER PROFILE
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| Company: | Huizhou DOCBOND NEW MATERIAL CO.,LT | ||
| City/State | Huizhou, Guangdong | Country: |
China 
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| Business Type: | Export - Manufacturer / Trading Company | Established: | 2014 |
| Member Since: | 2023 | Contact Person | Kang Cheng |
SUPPLIER PROFILE
City/State/Country -
Huizhou, Guangdong
China
Business Type -
Export - Manufacturer / Trading Company
Established -
2014
Member Since -
2023
Contact Person -
Kang Cheng