Ceramic Substrate Metallization

Substrate material thickness：0.65mm
Conducting layer：Cu
Thickness of metal layer：200μm
Surface preparation：OSP
Metal single-sided / double sided：double sided
Copper plated through hole：yes
SoldePCB substrate has become an indispensable main component of most electronic products. In the manufacture of printed circuit boards by circuit board manufacturers, whether it is copper-clad or prepreg plays a very important role in printed boards. It has three functions of conductivity, insulation and support. The performance, quality, processability, manufacturing cost, and manufacturing level of a PCB substrate depend to a large extent on the substrate material.r mask：yesPCB substrate has become an indispensable main component of most electronic products. In the manufacture of printed circuit boards by circuit board manufacturers, whether it is copper-clad or prepreg plays a very important role in printed boards. It has three functions of conductivity, insulation and support. The performance, quality, processability, manufacturing cost, and manufacturing level of a PCB substrate depend to a large extent on the substrate material.