BERGQUIST Q-Pad 3 SIL PAD TSP Q2000

FEATURES AND BENEFITS

• Thermal impedance: 0.35¨C-in 2 /W

(@50 psi)

• Eliminates processing constraints

typically associated with grease

• Conforms to surface textures

• Easy handling

• May be installed prior to soldering and

cleaning without worry

BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks.

Fiberglass reinforcement enables BERGQUIST Q3 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.