BERGQUIST GP3000S30 GAP PAD 3000S30 GAP PAD TGP 3000

BERGQUIST GP3000S30 GAP PAD 3000S30 GAP PAD TGP 3000

BERGQUIST GAP PAD TGP 3000 is a soft gap filling material
rated at a thermal conductivity of 3 W/m-K. The material offers
exceptional thermal performance at low pressures due to an all
new 3 W/m-K filler package and low-modulus resin formulation.
It is reinforced to enhance material handling, puncture, shear
and tear resistance. It is well suited for high performance,
low-stress applications that typically use fixed standoff or clip
mounting. BERGQUIST GAP PAD 3000S30 maintains a
conformable yet elastic nature that allows for excellent
interfacing and wet-out characteristics, even to surfaces with
high roughness and/or topography.
BERGQUIST GAP PAD TGP 3000 is offered with natural
inherent tack on both sides of the material, eliminating the
need for thermally-impeding adhesive layers. The material’s
natural inherent tack allows for stick-in-place characteristics
during assembly. BERGQUIST GP3000S30 is
supplied with protective liners on both sides. The top side has
reduced tack for ease of handling.

TYPICAL APPLICATIONS
● Processors
● Server S-RAMs
● Mass storage drives
● Wireline / wireless communications hardware
● Notebook computers
● BGA packages
● Power conversion