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BERGQUIST GAP PAD TGP HC3000
| Price: | US$ 1 / Sheet |
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| Minimum Order: | 5 |
| Payment Terms: | TT |
| Port of Export: | Shenzhen |
Product Details
| Model No.: | GPHC3.0 | Brand Name: | BERGQUIST |
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| Certification: | |
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| Specification: | 203*406mm |
Packaging & Delivery
| Packaging: | BOX |
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| Delivery/Lead Time: | 3 DAYS |
| Production Capacity: | 1000sheet/week |
Product Description
BERGQUIST GPHC3.0,GAP PAD HC 3.0,GAP PAD TGP HC3000 BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K.The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and lowmodulus resin formulation. The enhanced material is ideal for applications requiring
low stress on components and boards during assembly. BERGQUIST GPHC3.0 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness and/or topography.
BERGQUIST GAP PAD HC 3.0 Typical Applications Include:
• Telecommunications
• ASICs and DSPs
• Consumer electronics
• Thermal modules to heat sinks
Configurations Available:
• Sheet form and die-cut parts
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SUPPLIER PROFILE
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| Company: | Shenzhen Hothree Technology Co., Ltd. | ||
| City/State | Shenzhen, Guangdong | Country: |
China 
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| Business Type: | Export/Import - Trading Company | Established: | 2011 |
| Member Since: | 2021 | Contact Person | Carrie Huang |
SUPPLIER PROFILE
City/State/Country -
Shenzhen, Guangdong
China
Business Type -
Export/Import - Trading Company
Established -
2011
Member Since -
2021
Contact Person -
Carrie Huang