BERGQUIST BP108 BOND-PLY 100 BOND-PLY TBP 850

BERGQUIST BP108 BOND-PLY 100 BOND-PLY TBP 850

Thermally Conductive, Fiberglass-Reinforced Pressure-Sensitive Adhesive Tape

Features and Benefits
• Thermal impedance: 0.52§C-in. 2 /W
(at 50 psi)
• High bond strength to a variety
of surfaces
• Double-sided, pressure sensitive
adhesive tape
• High performance, thermally
conductive acrylic adhesive
• Can be used instead of heat-cure
adhesive, screw mounting or
clip mounting

Typical Applications Include:
• Mount heat sink onto BGA graphic
processor or drive processor
• Mount heat spreader onto power
converter PCB or onto motor control PCB

Configurations Available:
• Sheet form, roll form and die-cut parts
Shelf Life: The double-sided, pressure sensitive adhesive used in BOND-PLY products
requires the use of dual liners to protect the surfaces from contaminants. Henkel
recommends a 6-month shelf life at a maximum continuous storage temperature of
35§C or 3-month shelf life at a maximum continuous storage temperature of 45§C, for
maintenance of controlled adhesion to the liner. The shelf life of the BOND-PLY material,
without consideration of liner adhesion (which is often not critical for manual assembly
processing), is recommended at 12 months from date of manufacture at a maximum
continuous storage temperature of 60§C.