6-layer rigid-flexible board / P/N:SG-RFPC-J30060

6-layer rigid-flexible board / P/N:SG-RFPC-J30060
1.surface finished:immersion gold,green soldermask.
2. material:FR4(shenyi),flexible PI(GRACE) and rolled copper foil
rigid section's dielectric constant stabilization, the flexible section's fold is good, resist hightemperature.
3. produce analysis:
hole diameter(min.)0.3mm,W/S(min.)over 6MIL,none BGA,circuitry shrink,easily to process.
4. produce process:
first produce double-side flexible circuitry,add thermosetting polyimide,then produce twain side inner rigid board, once complete laminate,clean surface,drill desmear produce out-layer circuitry,CNC,sample finish.
5. difficulty: contorl the thermosetting polyimide overflow,side expose Cu,oxidation,etc.