4 Layer Flexible Printed Circuit Board

Board Thickness

0.07-0.40mm

Base Material

0.5mil - 2mil Polyimide

Copper Thickness

0.5OZ-2OZ

Stiffener

PI: 0.10-0.25UM, Fr4: 0.1-1.20MM, PET: 0.10-0.18MM, Metal:0.10-0.30MM

Min. Line Width/ Spacing

3mil (0.08mm)/3mil (0.08mm)

Coverlay

Yellow, White, Balck
Silkscreen Color

White, Black

Surface Finishing

ENIG, Flash Gold, Immersion Tin, OSP

Min.Quantity of Order

No MOQ

Layer Count

1-8 Layer
Item

Description

Capability

Material

Type

Adhesive, Adhesive, Halogen-free

Polyimide Thickness

0.5mil,1mil,2mil

Adhesive Thickness

0.5mil, 0.8mil

Copper (ED ,RA)

1/3oz 1/2oz 1oz

Coverlayer

Polyimide Thickness

15um, 25um, 50um

Adhesive Thickness

12.5um, 20um,25um

Colors

White, Black, Yellow

Min Coverlay Opening Size

0.40mm(Drill), 0.25mm(Laser), 0.7mm(punch)

Min Space Between Coverlay Opening

0.15mm(Drill), 0.20mm(Laser), 0.6mm(punch)

Edge of Coverlay Opening to Trace

0.15mm

Stiffeners

PI

0.1-0.25mm

PET

0.1-0.18mm

Fr4

0.1-1.2mm

Metal

0.1-0.3mm

Surface Treatment

ENIG

Au: 0.025-0.1um Ni: 3-8um

Flash Gold

Au:0.025-0.1um Ni:3-8um

Immersion Tin

≥1um

OSP

0.2-0.6um

Drilling

Min Laser Drilling

0.1mm

Mechanical Drilling

0.2-6.5mm

Aspect Ratio

1:0.8(Laser) 12:1(Mechanical)

Min distance Via to Conductor

0.2mm(≤4Layer), 0.25mm(≤6Layer)

Min distance Drill to Drill

0.2mm

Copper Plated Thickness

Double side board: ≥8um

Multilayer: ≥12um

Rigid flex board: ≥18um

TFT :8-15um

Annular ring

Outer layer

0.15mm

Inter layer

0.15mm(4Layer)

0.25mm(6Layer)

0.30mm(6Layer)

Out layer

Base Copper 1/3OZ

0.07/0.07mm

Base Copper 1/2OZ

0.08/0.10mm

Base Copper 1OZ

0.10/0.12mm

Trace Width Tolerance

+/-20%

Inter layer

Copper 1/3OZ

0.07/0.07mm

Copper 1/2OZ

0.08/0.10mm

Copper 1OZ

0.10/0.12mm

Trace Width Tolerance

+/-20%

Solder Mask

Colors

Green, Yellow , Black, White, Blue, Red, Matte green

Min dam width

0.1mm（green color） 0.15mm(other colors )

Thickness

10-18um(Corner≥5um)

Colors

Yellow, White, Black

Legend

Min. Legend Height

0.8mm

Profile

Mechanical Routed Part Size Tolerance

+/-0.10mm

Laser Routed Part Size Tolerance

+/-0.10mm

Min. Diameter Rout Cutter

0.8mm

Copper to Outline Center

0.2mm

EMI Shield Film

SF-PC5000/5500/5900

11um/22um/9um

SF-PC1000

32.1um

TSS200/TSS100

22um/12um

Other

Max Copper Thickness

2OZ(Outer) 2OZ(Inter)

Layer Count

1-6(Flexible) 2-6(Rigid Flex)

Board Thickness

1L: 0.10mm-0.16mm 2L: 0.13-0.25mm

4L: 0.25mm-0.45mm 6L: 0.35-0.45mm

FPC Thickness Tolerance

+/-0.05mm(≤0.5mm) ; +/-10%mm(>0.5mm)

Min board dimensions

5*8mm

Max board dimensions

230*330mm(Convention); 480*630mm(Special)

Twisting and bending

≤0.75% Min0.5%

Impedance Tolerance

+/-5Ω(<50Ω) , +/-10%(≥50Ω)