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Found 28725 products
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Kohesi Bond KB 1031 AT-2LO is a two component, highly flexibilized epoxy system suitable for bonding, sealing, potting and encapsulation. It has a...
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Kohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient...
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Kohesi Bond KB 1031 ATFL-N is a two component, highly flexibilized, nickel filled epoxy system suitable for bonding and sealing. It has a convenient...
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Kohesi Bond KB 1031 ATHT-LO is a two component, highly toughened epoxy system suitable for bonding, sealing and coating applications. It has a...
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Kohesi Bond KB 1031 SPLV-6 is a two component epoxy system for bonding, sealing, coating and encapsulating. It has a convenient 1:1 (Part A: Part B)...
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Kohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a...
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Kohesi Bond KB 1039 CRLP-AO is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a...
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Kohesi Bond KB 1040 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a...
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Kohesi Bond KB 1040 AN-1 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a...
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Kohesi Bond KB 1040 AOHT is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It...
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Kohesi Bond KB 1040 CTE-LO is an exclusive two component epoxy system suitable for bonding, sealing, coating and encapsulation applications. It has a...
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Kohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a...
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Kohesi Bond KB 1040 QF is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It...
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Kohesi Bond KB 1040-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating and encapsulating applications....
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Kohesi Bond KB 10473 FL is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a...
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Kohesi Bond KB 10473 FLAO is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a...
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Kohesi Bond KB 1048 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a...
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Kohesi Bond KB 1085-1 is a two component, graphite filled epoxy system suitable for bonding, sealing and coating. It has a favorable 100:15 (Part A:...
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Kohesi Bond KB 1151 S-1 is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It...
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Kohesi Bond KB 1372 LP is a two component, heat curing epoxy system suitable for bonding, sealing, coating and encapsulation. It has a favorable...
